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 Item Number |

10131 |
The Cascade Microtech 10000-series probe systems allow you to access the full measurement range of your test instrumentation. Noise, leakage, stray capacitance and measurement settling times have been greatly reduced. Whatever the application: DC or RF device characterization, wafer-level reliability, e-test, modeling, or yield enhancement, the 10000-series probe stations assure best-in-the-world measurements.
The Summit 10600 Thermal Probing System with its integrated MicroChamber (TM) shields the wafer under test from the ambient air, light, and electromagnetic interference (EMI). Because the MicroChamber is small (0.25 ft3/7.0 I) compared to a glove box, the purge time is less than 15 minutes (compared to several hours for a glove box). An automatic calibration procedure removes the temperature-related drift caused by the probes and cables changing temperature.
The Summit 10000-series system has been used for developing and verifying device models. This means that accuracy is critical, as these models are used to design complex ICs that need to work the first time.
|
 SYSTEM INFORMATION |
 Model Number: |

SUMMIT 10600 |
 Serial Number: |

0100599 |
 Vintage: |

1995 |
 SYSTEM CONFIGURATION |
 Prober Base: |

Summit 10000-series probe station with logic module, driver module, monitor, keyboard, and joystick
|
 Prober Optics: |

Optics Bridge-Mount option with a Cambridge Instruments Microzoom II microscope including: trinocular head, 10x eyepieces (qty 2), Leica 2.25x/0.04 LWD objective lens (qty 1), Leica 8x/0.15 LWD objective lens (qty 1) , and Leica 25x/0.31 LWD objective lens (qty 1)
|
 ACCESSORIES / OPTIONS / UPGRADES (INSTALLED) |
 CCD Camera and Display: |

Included |
 Probe Positioners: |

0-degree micro positioners; x, y, z-axis (qty 2) |
 Probe Tips: |

Cascade ACP 40 probe tips (currently installed) |
 Wafer Chuck: |

150mm thermal chuck (gold)
|
 Microchamber: |

Patented Microchamber option installed |
 Triax Bulkhead Option: |

(Qty 10) Triax connectors installed (max 12 positions available) and Shorting link mounted to the platen for ease of accessibility for test connections |
 Banana-Post Bulkhead Option: |

(Qty 12) Banana-post connectors mounted to the platen for ease of accessibility for test connections |
 Vacuum Manifold Option: |

Not installed |
 Calibration Standard: |

Cascade p/n 101-190B, s/n 20418 (with documentation)
|
 Thermal Controller: |

Temptronic model# TPO3000-2300-1 thermal controller (temperature range -65C to +200C) with Temptronic model# SA76440 air dryer |
 SPECIFICATIONS |
 Wafer Chuck Size: |

152mm x 152mm (6in x 6in)
|
 X / Y Stage Travel: |

152mm x 152mm (6in x 6in) |
 Rotation Travel / Resolution: |

14-degrees; 3-degrees per turn
|
 Z-Axis Travel: |

>5mm (0.200in)
|
 Repeatability: |

+/- 1um
|
 Material: |

Gold plated |
 Positioners (Short Travel): |

x / y axis = 13mm (0.50in); z-axis = 11mm (0.43in)
|
 Positioners (Long Travel): |

x / y axis = 76mm (3in) |
 Base Dimensions: |

610mm x 610mm (24in x 24in)
|
 Typical Height to Eyepiece: |

560mm (22in) |
 Weight (Approx, Net): |

114kg (250lbs)
|
 LOGIC CONTROLLER* |
 Hard Disk Size: |

40MB |
 Microprocessor: |

80386 |
 RAM: |

640KB
|
 Floppy Drive: |

3.5in; 1.44MB |
 Graphics Card: |

Color, VGA
|
 Monitor: |

Color
|
 NOTE: |

VIBRATION / ISOLATION TABLE SHOW IS FOR DISPLAY PURPOSES ONLY. THIS TABLE, OR SIMILAR TABLES CAN BE PURCHASED SEPARATELY, SUBJECT TO AVAILABILITY |
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