The Matrix System One 105E Plasma Asher/Stripper/Descum provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, and square. Capable of handling substrate sizes ranging from 3” up to 6”.
Wafer Size:
Capable of handling wafers up to 150mm (6 inches)
Process Control:
Multi-step program (three steps + over etch) process programming with independent control of pressure, RF power, temperature, gas flow, & substrate position
RF Generator:
ENI OEM-6XL water-cooled RF generator (600W at 13.56Hz)
