The K&S 4523 Manual Wedge Bonder can be used for process development, production, research or added manufacturing support. The K&S 4500 Series Manual Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: Optoelectronic Modules, Hybrid/MCMs, Microwave Products, Discrete Devices/Lasers and Chip-on-Board devices.
Vintage:
2001
EQUIPMENT SPECIFICATIONS:
Controls:
Microprocessor controlled bonding cycle and bonding parameter(s) application.
Z Axis Control:
Independent Manual Z axis control, separate from X and Y axis control.
Wire Parameter Adjustments:
Independently adjustable Wire Parameters
- Separate Force control for each bond, adjustable and independent per channel - Separate Bond Time control for each bond - Separate Bond Power control for each bond.
Bond Force Control:
No springs are used to apply bond force; digitally controlled components are utilized.
Tool Assembly for Multiple Bonding Applications:
Standard bonding , Deep Access and Ribbon bonding with same Bond Head "tool assembly". No need to change "tool assembly".
Wire Clamp Motion:
Motorized Wire Clamp Motion with Linear Stepper Motor.
Stitch Mode:
Stitch Mode is included.
Vacuum/Air Pressure:
No vacuum or air pressure is required for operation.
Standard Reset Height:
0.260" with full range fine Z Motion control.
High Reset Height:
0.500" for tall package clearance.
Wire Sizes:
From .0007" dia. to .003" dia. (18 - 75 Micron Diameter) Aluminum and Gold.
