The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure
FEATURES:
Substrate Loading:
Easy, drawer-type slide to load substrates
Operating Pressure:
Atmospheric pressure
Cleaing Process:
Dry process using UV light, Ozone and Heat to completely clean delicate electrical circuits
APPLICATIONS:
Stripping photoresist and polyimide; ink removal from EPROM wafers (without erasing programs); removing organic contamination from substrates prior to thin film deposition; preparing surface for photoresist; descumming photoresist and E-Beam resist; cleaning wafers prior to wafer bonding
