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Item Number |
10048 |
| The EVG101 series performs R&D type processes on a single chamber design, which is fully compatible with EV Group automated systems. Besides all photo resists and polymers, The EVG101 Advanced Resist Spin Coating System supports specific processes such as wax coating or spin-on glass (SOG) coating and accepts small substrates, The EVG101 Spin Coater is a flexible tool for compound semiconductor and MEMS applications. |
Description: |
Semi-automatic spin coater with manual loading, for wafer sizes 3" - 8". Tooled for 4"-6" wafers |
Basic Unit For One Coat Module: |
Base frame for one resist processing module includes all electronics, pneumatics, tubing for solvents (if applicable) and drain, exhaust lines; Manual loading and mechanical prealignment via Teflon pins; Interchangeable automatic prealigner, pneumatically actuated for manual wafer loading sequence; Booster fan for exhaust; PC included; Self diagnostics and initialization during start up; Software; PC-controlled recipe programming, password protected access levels for operator, engineer and maintenance; MS-Windows® based graphical user interface (GUI) |
Resist Dispense System: |
Resist pump with all required controllers tubing and software; Hi-Torque motor for wide range of resist types; Millipore® filter stacks; Resist bottle adapter and mount with load cell in external tray; Resist level displayed in software programmable warning level and empty level |
Syringe Pump: |
For universal resists applications; Dispense system without dead volume; Especially for low volume production, expensive resist types and resist with short shelf lifetime; Programmable dispense rate; Adjustable suck back; For all kinds of resist, including BCB and thick resist |
Coat Module for Spin Coating: |
PTFE spinner chamber; Programmable drive unit for up to 10000 rpm; Programmable dispense arm for center, edge and area dispense; Spinner chuck tooled for 4"-6" wafers; Prealigner paddle and adjustment tool(s); Drain tank with filling level sensor underneath coat module; Exhaust flow interlocked and displayed (Magnehelic); Fully software controlled center, edge and area dispense modes; Integrated Solvent line for bowl wash; Dummy dispense and park position |
Closed Spin Chamber: |
For one coat module; For best uniformity with high viscosity resist; Automatically operated chamber cover; Software for fully programmable cover position in process; With 6 integrated nozzles for bowl wash |
Stand-alone Bake Module: |
For soft-, hard- or post exposure bake process; Hot plate for manual loading; Aluminum heater chuck for up to 150 °C with proximity pins; Temperature uniformity ± 1 °C at 100 °C; Proximity pins removable for contact baking; With temperature controller and power supply; For integration in basic unit for 2 process modules or stand alone (desk top system - requires table). |
Top Side Edge Bead Removal (EBR) System For 4"-6" Wafers: |
For one coat module; Solvent nozzle is mounted on programmable dispense arm; Software for fully programmable EBR process; Solvent is dispensed via pressurized tank as listed in basic unit (separate EBR tank optional) |
Back Side Rinse (BSR) System For 4-6"+D217 Wafers: |
For one coat module; Nozzle in chamber insert; For bottom side EBR; Software for fully programmable for back side rinse process; Solvent is dispensed via pressurized tank as listed in basic unit (separate EBR tank optional) |
External Tray: |
Any combination of tanks or resist dispense systems (either two tanks and two resist dispense systems or one of each); 1 Tank included; Use of Acetone with one tank not recommended |
Vintage: |
2002 |
Condition: |
New in the OEM crate; never used |
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