The Hitachi S-7000 CD SEM is an in-process evaluation tool for monitoring wafers during the during the various process steps. Non-destructive wafer inspection is ideal for observing complete wafers to identify problems such as stacking-faults, deep holes, etc.
Date of Manufacture:
1991
Wafer Size:
Accommodates 4", 5" and 6" wafers. Set size = 5".
Secondary Electron Image Resolution:
15nm (150 angstroms) at 1kV
Magnification:
100x to 100,000x
CD Measurement Range:
0.05 to 100 microns
Electron Beam Source:
Field emission electron gun
Accelerating Voltage(V0):
0.7~3kV (in increments of 100V)
Emission Extracting Voltage(V1):
0~6.3kV
Lens System:
2-stage electromagnetic lens reduction
Objective Lens Aperture:
Moveable type(4 openings selectable and alignable outside column
Stigmator:
8-pole electromagnetic type(X,Y)
Scanning Coil:
2-stage electromagnetic type
Specimen Stage Movement:
X-direction = 150nm, Y-direction = 150nm, Z-direction (working distance) = 5 to 15mm, T (tilt) angle = 0 to 60 degrees, R (rotation) angle = 360 degrees
Wafer Holder:
Holder replaceable for each wafer size
Wafer Setting:
Auto vacuum chucking using orientation flat reference
Wafer Transfer:
Wafer cassette to wafer holder in loader chamber (automatic)
