Spectrum Process Equipment, Inc. - Surface Technology Systems (STS) Multiplex (Plasma Wafer Processor Equipment)

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Surface Technology Systems (STS) Multiplex Plasma Wafer Processor

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Item Number	10037
SYSTEM DESCRIPTION:	STS Multiplex plasma wafer processor capable of processing up to 8inch wafers
SYSTEM CONFIGURATION:
Module Type:	Chamber - ICP-AOE - Version No: 2.0
Loadlock Type:	Carousel Loadlock for 200mm wafers with qty-2 150mm wafer adaptors
Process Module:	MESC Multiplex ICP HCH250M process chamber; ICP 250H Source (SiOx type); High capacity electrode temperature control (+5 to +180 deg C); Mechanical wafer clamping electrode (tripod lift - high temp) with He backside cooling; 600 Watt (13.56MHz) RF supply and matching unit; 3kW (13.56MHz) RF power supply and matching unit; Leybold MAG2000CT turbo pump; Edwards iQDP80 dry pumps; Watlow 4x 700W cartridge heaters; chamber parts for 1 x 150mm substrate (Mechanical Clamp); hinged chamber lid; chamber insulation jackets (V2 BH thermal jackets)
Electrode Cooling:	Huber Unistat T327WHT (Lower); Affinity RAA-005J-CE01CBD with 1 Meg DI water filter (Upper)
Electrode Heating:	Watlow 4x 700W cartridge heater +Huber T326WHT heater (60Hz: Syltherm: +5 to +185C)
Gasbox:	02 (500sccm), CF4 (100 sccm), N2 (1000 sccm), Ar (100 sccm), NF3 (100 sccm), Ar (100 sccm), N2 (spare; 100sccm), SiH4 (500 sccm), TEOS (100 sccm)
Vapour / Liquid Delivery Unit:	Eagle-Pitcher 4 (TEOS)
End Point Detector:	None
Vintage:	2001
Condition:	In OEM crate; never installed

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