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Esec 8003 Wafer Dicing Saw
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Item Number 		spacer
10033
The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability.
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Equipment Specifications:
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Wafer diameter: 		spacer
25.4mm-152.4mm (1in.-6in.)
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Wafer thickness: 		spacer
0.01mm-5.0mm (0.3mil-196.9mil)
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X-axis (feed): 		spacer
240mm (9.45in.)
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Y-axis (index): 		spacer
165mm (6.5in.)
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Index step: 		spacer
0.02mm-99.999mm (0.79mil-3937mil)
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Z-axis (verticle): 		spacer
10mm (.393in.)
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Rotation angle: 		spacer
0.01-165 degrees
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Spindle speed: 		spacer
15,000-50,000 rpm
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Power requirements: 		spacer
220VAC, 50/60Hz, 2.5kVa
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Air pressure: 		spacer
64-85 psi
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Water pressure: 		spacer
to 85 psi
(Click on photo to enlarge)
Esec 8003 (Wafer Dicing Saw Equipment) Esec 8003 (Wafer Dicing Saw Equipment) Esec 8003 (Wafer Dicing Saw Equipment)

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Esec 8003 (Wafer Dicing Saw Equipment)
Spectrum Process Equipment, Inc.
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