The Glen R3A Plasma Cleaning System is PLC controlled and offers real-time plain English readout of system operating parameters together with remedial action in the event of an abort. This 500 watt plasma cleaner has two 14 x 14-inch electrode sets (capable of up to 8 sample trays) which can be quickly configured to provide any of these three plasma modes: Active Plasma for routine cleaning of sample surfaces; RIE Plasma for aggressive cleaning of non ESD sensitive samples; and Downstream, Electron-Free Plasma for cleaning sensitive electronic components normally associated with the semiconductor industry. The Glen R3A Plasma Cleaner can be operated in a single or dual plasma sequence with two computer selected plasma gas inputs and a connection for a backfill gas (typically nitrogen). The Glen R3A has RS 232 interface as standard.
The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure
Surface Technology Systems (STS) Multiplex Advanced Oxide Etcher (AOE)
The Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock with STS etch plasma sources to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications.
Surface Technology Systems (STS) Multiplex Reactive Ion Etcher (RIE)
The Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock with STS etch plasma source to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications.
Surface Technology Systems (STS) Multiplex ICP High Rate Inductively-Couple Plasma Etcher
Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock combined with STS etch plasma sources to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications. Surface Technology Systems ASE Process is the market-leading deep reactive ion etch (DRIE) process from STS plc, used for deep anisotropic silicon etching.
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