| (click on the Item Number for details) |
| 10044 |
Branson/IPC 3000C-2 Barrel Plasma Reactor |
| 10043 |
Branson/IPC 4000C Barrel Plasma Reactor |
| 10042 |
Branson/IPC S3000 Barrel Plasma Reactor |
| 10041 |
Branson/IPC S3100 Barrel Plasma Reactor |
| 10047 |
Glen R3A Plasma Cleaner |
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The Glen R3A Plasma Cleaning System is PLC controlled and offers real-time plain English readout of system operating parameters together with remedial action in the event of an abort. This 500 watt plasma cleaner has two 14 x 14-inch electrode sets (capable of up to 8 sample trays) which can be quickly configured to provide any of these three plasma modes: Active Plasma for routine cleaning of sample surfaces; RIE Plasma for aggressive cleaning of non ESD sensitive samples; and Downstream, Electron-Free Plasma for cleaning sensitive electronic components normally associated with the semiconductor industry. The Glen R3A Plasma Cleaner can be operated in a single or dual plasma sequence with two computer selected plasma gas inputs and a connection for a backfill gas (typically nitrogen). The Glen R3A has RS 232 interface as standard. |
| 10117 |
Matrix System One Stripper 105E Plasma Stripper |
| |
The Matrix System One 105E Plasma Asher/Stripper/Descum provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, and square. Capable of handling substrate sizes ranging from 3” up to 6”. |
| 10087 |
Plasmatherm SLR 770 Inductively-Coupled Plasma (ICP) Etcher |
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Plasmatherm SLR Series 770 single chamber, loadlock, ICP etcher for processing wafers from 2-inches to 8-inches. |
| 10076 |
Samco UV-300H UV-Ozone Stripper / Cleaner |
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The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure |
| 10077 |
Surface Technology Systems (STS) Multiplex Advanced Oxide Etcher (AOE) |
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The Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock with STS etch plasma sources to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications. |
| 10050 |
Surface Technology Systems (STS) Multiplex Reactive Ion Etcher (RIE) |
| |
The Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock with STS etch plasma source to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications. |
| 10074 |
Surface Technology Systems (STS) Multiplex ICP High Rate Inductively-Couple Plasma Etcher |
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Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum loadlock combined with STS etch plasma sources to produce a platform of unrivalled quality and reliability for both R&D and pilot-production applications. Surface Technology Systems ASE Process is the market-leading deep reactive ion etch (DRIE) process from STS plc, used for deep anisotropic silicon etching. |
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Displaying records 1 thru 11
(Total of 11 records found ) |
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