The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability.
Keller Technology Corporation (KTC) BT-30 Bond Tester
The Keller Technology Corporation KTC BT-30 bond tester is ideal for destructive and non-destructive testing of die bonds, ball bonds and bond shear testing.
The K&S 4523 Manual Wedge Bonder can be used for process development, production, research or added manufacturing support. The K&S 4500 Series Manual Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: Optoelectronic Modules, Hybrid/MCMs, Microwave Products, Discrete Devices/Lasers and Chip-on-Board devices.
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