| (click on the Item Number for details) |
| 10078 |
Benchmark Gen-II Model 8000 Parallel Seam Sealer |
| 10044 |
Branson/IPC 3000C-2 Barrel Plasma Reactor |
| 10043 |
Branson/IPC 4000C Barrel Plasma Reactor |
| 10042 |
Branson/IPC S3000 Barrel Plasma Reactor |
| 10041 |
Branson/IPC S3100 Barrel Plasma Reactor |
| 10073 |
Equipment Support Company (ESC) ELAS Sputtering System |
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The ELAS (ESC Large Area Sputtering System) offers cassette to cassette operation for 4-inch, 6-inch and 8-inch wafers using an industry standard Brooks robot system. |
| 10033 |
Esec 8003 Wafer Dicing Saw |
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The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability. |
| 10048 |
EV Group EVG101 Advanced Resist Spin Coating System |
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The EVG101 series performs R&D type processes on a single chamber design, which is fully compatible with EV Group automated systems. Besides all photo resists and polymers, The EVG101 Advanced Resist Spin Coating System supports specific processes such as wax coating or spin-on glass (SOG) coating and accepts small substrates, The EVG101 Spin Coater is a flexible tool for compound semiconductor and MEMS applications. |
| 10047 |
Glen R3A Plasma Cleaner |
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The Glen R3A Plasma Cleaning System is PLC controlled and offers real-time plain English readout of system operating parameters together with remedial action in the event of an abort. This 500 watt plasma cleaner has two 14 x 14-inch electrode sets (capable of up to 8 sample trays) which can be quickly configured to provide any of these three plasma modes: Active Plasma for routine cleaning of sample surfaces; RIE Plasma for aggressive cleaning of non ESD sensitive samples; and Downstream, Electron-Free Plasma for cleaning sensitive electronic components normally associated with the semiconductor industry. The Glen R3A Plasma Cleaner can be operated in a single or dual plasma sequence with two computer selected plasma gas inputs and a connection for a backfill gas (typically nitrogen). The Glen R3A has RS 232 interface as standard. |
| 10040 |
Hitachi S-7000 Critical Dimension Scanning Electron Microscope (CD SEM) |
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The Hitachi S-7000 CD SEM is an in-process evaluation tool for monitoring wafers during the during the various process steps. Non-destructive wafer inspection is ideal for observing complete wafers to identify problems such as stacking-faults, deep holes, etc. |
| 10126 |
Karl SUSS MA4 Series III Mask Aligner |
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Karl Suss Mask Aligners are regarded as the benchmark in semiconductor submicron research and 3D micro-system production. These innovative systems meet customer's needs for precision and reliability.
This versatile SUSS MA4 is available with bottom-side-alignment microscopes (optical) for accurate backside processes. Optical bottom-side-alignment (BSA) has become an important feature, especially in Microsystem Technology.
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| 10024 |
Keller Technology Corporation (KTC) BT-30 Bond Tester |
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The Keller Technology Corporation KTC BT-30 bond tester is ideal for destructive and non-destructive testing of die bonds, ball bonds and bond shear testing. |
| 10083 |
Kullicke & Soffa (K&S) 4523 Manual Wedge Bonder |
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The K&S 4523 Manual Wedge Bonder can be used for process development, production, research or added manufacturing support. The K&S 4500 Series Manual Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: Optoelectronic Modules, Hybrid/MCMs, Microwave Products, Discrete Devices/Lasers and Chip-on-Board devices. |
| 10117 |
Matrix System One Stripper 105E Plasma Stripper |
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The Matrix System One 105E Plasma Asher/Stripper/Descum provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, and square. Capable of handling substrate sizes ranging from 3” up to 6”. |
| 10087 |
Plasmatherm SLR 770 Inductively-Coupled Plasma (ICP) Etcher |
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Plasmatherm SLR Series 770 single chamber, loadlock, ICP etcher for processing wafers from 2-inches to 8-inches. |
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Displaying records 1 thru 15
(Total of 24 records found ) |
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